Smart devices such as smartphones and wearables have changed the way we communicate and are transforming the cultural and social lives of just about everyone on the planet.

As smartphones and other electronic devices become smaller, slimmer and faster with almost unlimited features, international technical pioneers, talented product designers and global brands require new technologies and processes from manufacturing service providers and equipment suppliers to enable more complex functionality in smaller form factors. The brands that succeed will be from companies that leverage new manufacturing equipment to increase manufacturing capacities so they can produce smaller, low-cost electronics-based solutions in high volume in anticipation of future demands.

Mr. Asher Levy, CEO of Orbotech, recently disclosed the company''s new strategy and vision for this type of manufacturing equipment, and Orbotech''s move towards the development of advanced semiconductor packaging applications.

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