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Rugged Dual GPGPU OpenVPX Module delivers 5 TFLOPS in one slot.-The 17th Guanzhou Die-casting,Foundry&Industry Furnace Exhibition
4/12/2016 Die-casting,Foundry&Industry Furnace expo |
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ASHBURN, Va. ¨C Curtiss-Wright¡¯s Defense Solutions division today announced its second generation rugged GPU module for deployed Radar, SIGINT and EO/IR high performance embedded computing (HPEC) applications. The new CHAMP-GP3 GPGPU (general purpose graphics processor unit) Application Accelerator is the industry¡¯s first 6U OpenVPX module to bring the extensive floating point processing power of NVIDIA®¡¯s latest generation of Maxwell architecture class GPGPUs to the embedded aerospace and defense market. The board features dual 1536-core Tesla M6 MXMs high performance computing devices to provide an unprecedented 5 TFLOPS of compute performance in a single slot. Designed for compute-intensive applications that require extreme processing, the CHAMP-GP3 is the first COTS module to provide a size, weight and power (SWaP) optimized solution for system designers who seek the unmatched super computing capability of a Tesla GPGPU to address applications that can¡¯t be satisfied by aggregating multiple microprocessors. In conjunction, Curtiss-Wright also announced that it has been selected by NVIDIA to become a member of its NVIDIA Partner Network program.
The CHAMP-GP3 is designed for use in ISR and EW applications that require TFLOPS of accelerated processing. Thanks to its support for the popular CUDA™ and OpenCL programming languages, system designers using the CHAMP-GP3 can develop new applications in a fraction of the time required by FPGA-based solutions. The module is ideal for addressing the massive amounts of data generated by modern Radar, SIGINT and EO/IR sensors and provides unparalleled HPEC performance in cross-cueing applications.
¡°We are very pleased to introduce the embedded industry¡¯s highest performance OpenVPX GPU processor, the new CHAMP-GP3, which results from our exciting new alliance with NVIDIA as a member of their NVIDIA Partner Network,¡± said Lynn Bamford, Senior Vice President and General Manager, Defense Solutions division. ¡°In recent years, we have seen the use of GPUs in ISR and HPEC applications leap from the experimental stage to the implementation stage. These SWaP-sensitive programs are hungry for as much shear processing power as they can fit into a single board slot. With 5 TFLOPS of floating point performance the CHAMP-GP3¡¯s dual Tesla GPGPUs deliver the performance ISR and HPEC customers have been seeking.¡±
OpenHPEC™ Tools Speed and Ease Development
Because the CHAMP-GP3 supports Allinea Software¡¯s CUDA profiling, Curtiss-Wright¡¯s OpenHPEC™ Accelerator Suite™ of best-in-class software development tools, including Allinea DDT and Allinea MAP, can significantly speed and ease the development of systems using the CHAMP-GP3.
Complete Family of Next Generation ISR and HPEC Solutions
The CHAMP-GP3 is the newest addition to Curtiss-Wright¡¯s comprehensive portfolio of HPEC products designed to support the complete technology chain data flow, from the sensor to the operator. These industry-leading HPEC products include FMC/XMC data acquisition cards, the CHAMP-FX4 and CHAMP-AV9 FPGA-based processors, the CHAMP-XD2 and VPX6-1959 high-density multiprocessor boards, GPGPU co-processors and a large catalog of system level interface products.
-The 17th Guanzhou
Die-casting,Foundry&Industry Furnace Exhibition
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